Semiconductor device

ABSTRACT

A semiconductor device is provided. The semiconductor device includes first and second logic cells adjacent to each other on a substrate, and a mixed separation structure extending in a first direction between the first and second logic cells. Each logic cell includes first and second active fins that protrude from the substrate, the first and second active fins extending in a second direction intersecting the first direction and being spaced apart from each other in the first direction, and gate electrodes extending in the first direction and spanning the first and second active fins, and having a gate pitch. The mixed separation structure includes a first separation structure separating the first active fin of the first logic cell from the first active fin of the second logic cell; and a second separation structure on the first separation structure. A width of the first separation structure is greater than the gate pitch.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a Continuation Application of U.S. non-provisional applicationSer. No. 16/159,196 filed on Oct. 12, 2018, which claims priority under35 U.S.C. § 119 from Korean Patent Application No. 10-2018-0024411 filedon Feb. 28, 2018, in the Korean Intellectual Property Office, the entirecontents of which are hereby incorporated by reference in theirentirety.

BACKGROUND

Apparatuses, devices, and articles of manufacture consistent with thepresent disclosure relate to a semiconductor device, and moreparticularly, to a semiconductor device including a field effecttransistor. Semiconductor devices are beneficial in electronic industrybecause of their small size, multi-functionality, and/or low fabricationcost. Semiconductor devices may encompass semiconductor memory devicesstoring logic data, semiconductor logic devices processing operations oflogic data, and hybrid semiconductor devices having both memory andlogic elements. Semiconductor devices have been increasingly requiredfor high integration with the advanced development of the electronicindustry. For example, semiconductor devices have been increasinglyrequested to have characteristics including high reliability, highspeed, and/or multi-functionality. Semiconductor devices are graduallybecoming more complicated and more integrated to meet these requestedcharacteristics.

SUMMARY

It is an aspect to provide a semiconductor device including a fieldeffect transistor that has enhanced electrical characteristics.

According to an aspect of an exemplary embodiment, there is provided asemiconductor device including a first logic cell and a second logiccell that are adjacent to each other on a substrate; and a mixedseparation structure extending in a first direction between the firstlogic cell and the second logic cell, wherein each of the first logiccell and the second logic cell comprises a first active pattern and asecond active pattern that extend in a second direction intersecting thefirst direction and that are spaced apart from each other in the firstdirection; and a plurality of gate electrodes extending in the firstdirection and spanning the first active pattern and the second activepattern, and having a gate pitch, and wherein the mixed separationstructure comprises a first separation structure separating the firstactive pattern of the first logic cell from the first active pattern ofthe second logic cell; and a second separation structure on the firstseparation structure, wherein a width of the first separation structureis greater than the gate pitch.

According to another aspect of an exemplary embodiment, there isprovided a semiconductor device including a substrate including a firstactive region and a second active region, the first active region andthe second active region being spaced apart from each other in a firstdirection and extending in a second direction intersecting the firstdirection; a device isolation layer provided on the substrate anddefining a first active pattern and a second active pattern, the firstactive pattern and the second active pattern extending in the seconddirection on the first active region and the second active region,respectively; and a mixed separation structure spanning the first activeregion and the second active region and extending in the firstdirection, wherein the mixed separation structure comprises a firstseparation structure selectively spanning the first active patternexcept for the second active pattern; and a second separation structurespanning the first active pattern and the second active pattern, whereina first level of a first bottom surface of the first separationstructure is lower than a second level of a second bottom surface of thesecond separation structure.

According to another aspect of an exemplary embodiment, there isprovided a semiconductor device including a first logic cell and asecond logic cell that are adjacent to each other on a substrate; and amixed separation structure extending in a first direction between thefirst logic cell and the second logic cell, wherein each of the firstlogic cell and the second logic cell comprises a first active regionprovided with a plurality of first transistors having a firstconductivity; and a second active region provided with a plurality ofsecond transistors having a second conductivity different from the firstconductivity, and wherein the mixed separation structure comprises afirst separation structure separating the first active region of thefirst logic cell from the first active region of the second logic cell;and a second separation structure extending in the first direction onthe first separation structure and separating the second active regionof the first logic cell from the second active region of the secondlogic cell, wherein the second separation structure comprises a secondinsulating material different from a first insulating material of thefirst separation structure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a block diagram showing a computer system fordesigning a semiconductor device, according to exemplary embodiments;

FIG. 2 illustrates a flow chart showing a method of designing andmanufacturing a semiconductor device, according to exemplaryembodiments;

FIG. 3 illustrates a flow chart showing in detail a step S30 of placingand routing standard cells in the method of FIG. 2;

FIGS. 4 and 5 illustrate layouts according to exemplary embodiments,showing the step of placing and routing standard cells of FIG. 3;

FIG. 6 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments;

FIGS. 7A to 7E illustrate cross-sectional views respectively taken alonglines I-I′, II-II′, III-III′, IV-IV′, and V-V′ of FIG. 6;

FIGS. 8, 10, and 12 illustrate plan views showing a method ofmanufacturing a semiconductor device according to exemplary embodiments;

FIGS. 9A to 9D illustrate cross-sectional views respectively taken alonglines I-I′, II-II′, III-III′, and IV-IV′ of FIG. 8;

FIGS. 11A to 11E illustrate cross-sectional views respectively takenalong lines I-I′, II-II′, III-III′, IV-IV′, and V-V′ of FIG. 10;

FIGS. 13A to 13E illustrate cross-sectional views respectively takenalong lines I-I′, II-II′, III-III′, IV-IV′, and V-V′ of FIG. 12;

FIG. 14 illustrates a layout according to exemplary embodiments;

FIG. 15 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments;

FIGS. 16A to 16C illustrate cross-sectional views respectively takenalong lines I-I′, II-II′, and III-III′ of FIG. 15;

FIGS. 17A and 17B illustrate cross-sectional views respectively takenalong lines I-I′ and II-II′ of FIG. 15, showing a method ofmanufacturing a semiconductor device according to exemplary embodiments;

FIG. 18 illustrates a layout according to exemplary embodiments;

FIG. 19 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments;

FIGS. 20A to 20C illustrate cross-sectional views respectively takenalong lines I-I′, II-II′, and III-III′ of FIG. 19;

FIG. 21 illustrates a layout according to exemplary embodiments;

FIG. 22 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments;

FIG. 23 illustrates a cross-sectional view taken along line I-I′ of FIG.22;

FIG. 24 illustrates a layout according to exemplary embodiments;

FIG. 25 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments;

FIG. 26 illustrates a cross-sectional view taken along line I-I′ of FIG.25;

FIG. 27 illustrates a layout according to exemplary embodiments;

FIG. 28 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments;

FIGS. 29A to 29C illustrate cross-sectional views respectively takenalong lines I-I′, II-II′, and III-III′ of FIG. 28;

FIG. 30 illustrates a layout according to exemplary embodiments;

FIG. 31 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments;

FIGS. 32A and 32B illustrate cross-sectional views respectively takenalong lines I-I′ and II-II′ of FIG. 25;

FIG. 33 illustrates a layout according to exemplary embodiments;

FIG. 34 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments; and

FIGS. 35A and 35B illustrate cross-sectional views respectively takenalong lines I-I′ and II-II′ of FIG. 34.

DETAILED DESCRIPTION

FIG. 1 illustrates a block diagram showing a computer system fordesigning a semiconductor device, according to exemplary embodiments.Referring to FIG. 1, a computer system may include a central processingunit (CPU) 10, a working memory 30, an input/output (I/O) device 50, andan auxiliary storage 70. The computer system may be provided as adedicated device for designing a layout according to exemplaryembodiments. The computer system may be configured to drive variousprograms for design and verification simulation.

The CPU 10 may allow the computer system to execute software (e.g.,application programs, operating system, and device drivers). The CPU 10may process an operating system loaded in the working memory 30. The CPU10 may execute various application programs driven based on theoperating system. For example, the CPU 10 may process a layout designtool 32, a placement and routing tool 34, and/or an optical proximitycorrection (OPC) tool 36 that are loaded in the working memory 30.

The operating system or application programs may be loaded in theworking memory 30. When the computer system is booted up, based onbooting sequence, an operating system image (not shown) stored in theauxiliary storage 70 may be loaded to the working memory 30. Overallinput/output operations of the computer system may be supported by theoperating system. Likewise, the working memory 30 may be loaded with theapplication programs that are selected by a user or provided for a basicservice.

The layout design tool 32 for layout design may be loaded from theauxiliary storage 70 to the working memory 30. The working memory 30 maybe loaded from the auxiliary storage 70 with the placement and routingtool 34 that places designed standard cells and routes the placedstandard cells. The working memory 30 may be loaded from the auxiliarystorage 70 with the OPC tool 36 that performs an optical proximitycorrection (OPC) on designed layout data.

The layout design tool 32 may include a bias function by which specificlayout patterns are changed in shapes and positions defined by a designrule. In addition, the layout design tool 32 may perform a design rulecheck (DRC) under the changed bias data condition. The working memory 30may be either a volatile memory such as SRAM (Static Random AccessMemory) or DRAM (Dynamic Random Access Memory) or a nonvolatile memorysuch as PRAM (Phase change Random Access Memory), MRAM (Magnetic RandomAccess Memory), ReRAM (Resistance Random Access Memory), FRAM(Ferroelectric Random Access Memory), or NOR Flash memory.

The I/O device 50 may control user input/output operations of userinterfaces. For example, the I/O device 50 may include a keyboard or amonitor, allowing a designer to put relevant information.

The auxiliary storage 70 may serve as a storage medium for the computersystem. The auxiliary storage 70 may store the application programs, theoperating system image, and various data. The auxiliary storage 70 maybe provided in the form of one of memory cards (e.g., MMC, eMMC, SD, andMicro SD) or in the form of a hard disk drive (HDD). The auxiliarystorage 70 may include a NAND Flash memory having large memory capacity.Alternatively, the auxiliary storage 70 may include a NOR Flash memoryor a next-generation volatile memory such as PRAM, MRAM, ReRAM, andFRAM.

A system interconnector 90 may be provided to serve as a system bus forproviding a network in the computer system. The CPU 10, the workingmemory 30, the I/O device 50, and the auxiliary storage 70 may beelectrically connected through the system interconnector 90 and mayexchange data with each other. The system interconnector 90 may not belimited to the above descriptions, and may further include intermediarymeans for efficient management.

FIG. 2 illustrates a flow chart showing a method of designing andmanufacturing a semiconductor device, according to exemplaryembodiments.

Referring to FIG. 2, a high-level design of a semiconductor integratedcircuit may be performed using the computer system discussed withreference to FIG. 1 (S10). The high-level design may mean that anintegrated circuit corresponding to a design target is described with ahigh-level language of a hardware description language. For example, thehigh-level language such as C language may be used in the high-leveldesign. A register transfer level (RTL) coding or simulation may be usedto express in detail circuits designed by the high-level design. Inaddition, codes created by the RTL coding may be converted into anetlist, which netlist may be synthesized to describe an entiresemiconductor device. The synthesized schematic circuit may be verifiedby a simulation tool, and an adjustment process may be performed basedon the verified result.

A layout design may be performed to implement on a silicon substrate asemiconductor integrated circuit that is logically completed (S20). Forexample, the layout design may be performed based on the schematiccircuit synthesized in the high-level design or the netlistcorresponding to the schematic circuit.

A cell library for the layout design may include information aboutoperation, speed, and power consumption of the standard cell. A celllibrary for representing a layout of a specific gate-level circuit as alayout may be defined in most tools for designing layouts. The layoutmay be prepared to define shapes or dimensions of patterns constitutingtransistors and metal lines that will be actually formed on a siliconsubstrate. For example, in order to actually form an inverter circuit ona silicon substrate, it may be necessary to appropriately place ordescribe layout patterns such as PMOS, NMOS, N-WELL, gate electrodes,and metal lines thereon. For this, a search may be first performed toselect a suitable one of inverters predefined in the cell library.

Designed standard cells may be placed and routed (S30). For example,high-level lines may be provided on the placed standard cells. Theplaced standard cells may be well-designedly connected to each otherthrough the routing step. The placement and routing of the standardcells may be automatically performed by the placement and routing tool34 of FIG. 1.

After the routing step, a verification step may be performed on thelayout to check whether any portion of the schematic circuit violatesthe given design rule. The verification step may include a design rulecheck (DRC) for verifying whether the layout meets the given designrule, an electrical rule check (ERC) for verifying whether there is anissue of an electrical disconnection in the layout, and a layout vs.schematic (LVS) for verifying whether the layout is coincident with thegate-level netlist.

An optical proximity correction (OPC) step may be performed (S40). Aphotolithography process may be employed to achieve on a siliconsubstrate the layout patterns obtained by the layout design. The opticalproximity correction may be a technique for correcting an unintendedoptical effect occurred in the photolithography process. For example,the optical proximity correction may correct an undesirable phenomenonsuch as refraction or process side effects caused by characteristics oflight in an exposure process using the layout patterns. When the opticalproximity correction is performed, the designed layout patterns may beslightly changed (or biased) in shapes and positions.

A photomask may be generated based on the layout changed by the opticalproximity correction (S50). The photomask may generally be manufacturedby describing the layout patterns using a chromium layer coated on aglass substrate.

The generated photomask may be used to manufacture a semiconductordevice (S60). Various exposure and etching processes may be repeatedlyperformed in manufacturing the semiconductor device using the photomask.Through these processes discussed above, patterns defined in the layoutdesign may be sequentially formed on a silicon substrate.

FIG. 3 illustrates a flow chart showing in detail the step S30 ofplacing and routing standard cells of FIG. 2. FIGS. 4 and 5 illustratelayouts according to exemplary embodiments, showing the step of placingand routing standard cells of FIG. 3.

Referring to FIGS. 3 and 4, there may be disposed a first standard cellSTD1, a second standard cell STD2, and a third standard cell STD3(S110). The first to third standard cells STD1, STD2, and STD3 may belinearly arranged in a second direction D2. The first to third standardcells STD1, STD2, and STD3 may be different standard cells from eachother. The first, second, and third standard cells STD1, STD2, and STD3may respectively constitute first, second, and third logic circuits thatare different from each other.

Each of the first to third standard cells STD1, STD2, and STD3 mayinclude a first active region pattern RXP, a second active regionpattern RXN, and gate patterns GP. Each of the first to third standardcells STD1, STD2, and STD3 may further include additional layoutpatterns (e.g., active fin patterns, active contact patterns, gatecontact patterns, via patterns, and line patterns). For brevity ofdrawings and their description, the additional layout patterns may notbe illustrated in the first to third standard cells STD1, STD2, and STD3shown in FIGS. 4 and 5.

The first and second active region patterns RXP and RXN may extend inthe second direction D2. The first and second active region patterns RXPand RXN may be spaced apart from each other in a first direction D1. Thefirst active region pattern RXP may define a first active region, andthe second active region pattern RXN may define a second active region.

The gate patterns GP may extend in the first direction D1 and may bearranged along the second direction D2 intersecting (e.g., perpendicularto) the first direction D1. The gate patterns GP may be arranged to havethe same pitch. The pitch may be a distance between a center of a firstpattern and a center of a second pattern adjacent to the first pattern.The gate patterns GP may define gate electrodes.

A first diffusion break pattern FC may be disposed on a boundary of eachof the first to third standard cells STD1, STD2, and STD3. For example,the first diffusion break pattern FC may be disposed between neighboringstandard cells. The first diffusion break pattern FC may extend in thefirst direction D1. The first diffusion break pattern FC may separateneighboring standard cells from each other. The first diffusion breakpattern FC may define a first separation structure.

For example, a first cell boundary BD1 may be defined between the firstand second standard cells STD1 and STD2, and a second cell boundary BD2may be defined between the second and third standard cells STD2 andSTD3. The first diffusion break pattern FC may be disposed on each ofthe first and second cell boundaries BD1 and BD2. The first diffusionbreak pattern FC may separate the first active region pattern RXP of thefirst standard cell STD1 from the first active region pattern RXP of thesecond standard cell STD2. The first diffusion break pattern FC mayseparate the second active region pattern RXN of the first standard cellSTD1 from the second active region pattern RXN of the second standardcell STD2.

The first diffusion break pattern FC may overlap a pair of neighboringgate patterns GP. The first diffusion break pattern FC may have a firstwidth W1 in the second direction D2. A first distance L1 may be providedbetween opposite sidewalls of the pair of neighboring gate patterns GP.The first width W1 and the first distance L1 may be substantially thesame.

Referring to FIGS. 3 and 5, a mixed diffusion break pattern CSC may beprovided on each of the first and second cell boundaries BD1 and BD2(S120). For example, the mixed diffusion break pattern CSC may replacethe first diffusion break pattern FC on each of the first and secondcell boundaries BD1 and BD2. The mixed diffusion break pattern CSC mayinclude a first diffusion break pattern FC and a second diffusion breakpattern RC. The first and second diffusion break patterns FC and RC mayhave substantially the same width in the second direction D2.

The second diffusion break pattern RC may extend in the first directionD1. The second diffusion break pattern RC may extend from the secondactive region pattern RXN toward the first active region pattern RXP.The second diffusion break pattern RC may have substantially the samesize and shape as those of the first diffusion break pattern FCdiscussed above with reference to FIG. 4. Similar to the first diffusionbreak pattern FC discussed above with reference to FIG. 4, the seconddiffusion break pattern RC may separate neighboring standard cells fromeach other.

The first diffusion break pattern FC of the mixed diffusion breakpattern CSC may be disposed limitedly on the second active regionpattern RXN. The first diffusion break pattern FC of the mixed diffusionbreak pattern CSC may have a size approximately half that of the seconddiffusion break pattern RC. For example, the first diffusion breakpattern FC of the mixed diffusion break pattern CSC may separate thesecond active region pattern RXN of the first standard cell STD1 fromthe second active region pattern RXN of the second standard cell STD2.The mixed diffusion break pattern CSC may define a mixed separationstructure.

Thereafter, a routing step may be performed on the placed first to thirdstandard cells STD1, STD2, and STD3 (S130). The routing of the first tothird standard cells STD1, STD2, and STD3 may include placing high-levelline patterns (not shown) that electrically connect the first to thirdstandard cells STD1, STD2, and STD3 to one another. When the high-levelline patterns are placed, the first to third standard cells STD1, STD2,and STD3 may be connected to one another in accordance with a designedcircuit.

FIG. 6 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments. FIGS. 7A to 7E illustrate cross-sectionalviews respectively taken along lines I-I′, II-II′, III-III′, IV-IV′, andV-V′ of FIG. 6. FIGS. 6 and 7A to 7E exemplarily show a semiconductordevice actually achieved on a substrate when the layout of FIG. 5 isused.

Referring to FIGS. 5, 6, and 7A to 7E, first to third logic cells LC1,LC2, and LC3 may be provided. The first to third logic cells LC1, LC2,and LC3 may be arranged in the second direction D2. The first to thirdlogic cells LC1, LC2, and LC3 may respectively correspond to the firstto third standard cells STD1, STD2, and STD3 of FIG. 5. Each of thefirst to third logic cells LC1, LC2, and LC3 may constitute a logiccircuit. For example, each of the first to third logic cells LC1, LC2,and LC3 may be provided thereon with logic transistors constituting thelogic circuit. In some exemplary embodiments, the first to third logiccells LC1, LC2, and LC3 may include different logic circuits from eachother. The following describes in detail the logic transistors andelectrical lines constituting the first to third logic cells LC1, LC2,and LC3.

A substrate 100 may be provided. For example, the substrate 100 may beor include a silicon substrate, a germanium substrate, or asilicon-on-insulator (SOI) substrate. The substrate 100 may be providedthereon with a device isolation layer ST that defines a first activeregion PR and a second active region NR. For example, the first activeregion PR may be a PMOSFET region, and the second active region NR maybe an NMOSFET region. The first and second active regions PR and NR maybe defined by a second trench TR2 on an upper portion of the substrate100, and the device isolation layer ST may fill the second trench TR2.For example, the device isolation layer ST may include a silicon oxidelayer.

The first and second active regions PR and NR may be spaced apart fromeach other in a first direction D1 across the device isolation layer ST.The first and second active regions PR and NR may extend in the seconddirection D2 and run across the first to third logic cells LC1, LC2, andLC3.

The first active region PR may be provided thereon with a plurality offirst active patterns FN1 extending in the second direction D2. Thesecond active region NR may be provided thereon with a plurality ofsecond active patterns FN2 extending in the second direction D2. Thefirst and second active patterns FN1 and FN2 may be verticallyprotruding portions of the substrate 100. The first and second activepatterns FN1 and FN2 may be arranged along the first direction D1.

For example, the first active region PR may be provided thereon withthree first active patterns FN1 parallel extending along the seconddirection D2. For example, the second active region NR may be providedthereon with three second active patterns FN2 parallel extending alongthe second direction D2. The numbers and shapes of the first and secondactive patterns FN1 and FN2 respectively on the first and second activeregions PR and NR are exemplary, but not limited to that shown.

A first trench TR1 may be defined between a pair of the active patternsFN1 and FN2 adjacent to each other in the first direction D1. The deviceisolation layer ST may further fill the first trenches TR1.

The first and second active patterns FN1 and FN2 may have their upperportions higher than a top surface of the device isolation layer ST. Theupper portions of the first and second active patterns FN1 and FN2 mayvertically protrude beyond the device isolation layer ST. The upperportion of each of the first and second active patterns FN1 and FN2 maybe shaped like a fin protruding from the device isolation layer ST.

The upper portion of each of the first active patterns FN1 may includefirst channel regions CH1 and first source/drain regions SD1. The firstsource/drain regions SD1 may be p-type impurity regions. Each of thefirst channel regions CH1 may be interposed between a pair of the firstsource/drain regions SD1. The upper portion of each of the second activepatterns FN2 may include second channel regions CH2 and secondsource/drain regions SD2. The second source/drain regions SD2 may ben-type impurity regions. Each of the second channel regions CH2 may beinterposed between a pair of the second source/drain regions SD2.

The first and second source/drain regions SD1 and SD2 may be epitaxialpatterns formed by a selective epitaxial growth process. The first andsecond source/drain regions SD1 and SD2 may have their top surfaceshigher than those of the first and second channel regions CH1 and CH2.

For example, the first source/drain regions SD1 may include asemiconductor element whose lattice constant is greater than that of asemiconductor element of the substrate 100. As a result, the firstsource/drain regions SD1 may provide the first channel regions CH1 withcompressive stresses. Alternatively, the second source/drain regions SD2may include the same semiconductor element as that of the substrate 100.For example, the first source/drain regions SD1 may includesilicon-germanium, and the second source/drain regions SD2 may includesilicon.

When viewed in cross-section along the first direction D1, each of thefirst source/drain regions SD1 may have a cross-section different fromthat of each of the second source/drain regions SD2 (see FIG. 7E).

Gate electrodes GE may be provided to run across the first and secondactive patterns FN1 and FN2 and to extend in the first direction D1. Thegate electrodes GE may be spaced apart from each other in the seconddirection D2. A pair of neighboring gate electrodes GE may have a firstpitch P1 therebetween. The gate electrodes GE may be equally spaced atthe first pitch P1.

The gate electrodes GE may vertically overlap the first and secondchannel regions CH1 and CH2. Each of the gate electrodes GE may beprovided on a top surface and opposite sidewalls of each of the firstand second channel regions CH1 and CH2 (see FIG. 7D). For example, thegate electrodes GE may include one or more of conductive metal nitride(e.g., titanium nitride or tantalum nitride) and metal (e.g., titanium,tantalum, tungsten, copper, or aluminum).

A pair of gate spacers GS may be disposed on opposite sidewalls of eachof the gate electrodes GE. The gate spacers GS may extend in the firstdirection D1 along the gate electrodes GE. The gate spacers GS may havetop surfaces higher than those of the gate electrodes GE. The topsurfaces of the gate spacers GS may be coplanar with that of a gatecapping layer CP which will be discussed below. For example, the gatespacers GS may include one or more of SiCN, SiCON, and SiN.Alternatively, the gate spacers GS may include a multiple layerconsisting of two or more of SiCN, SiCON, and SiN.

Gate dielectric layers GI may be interposed between the gate electrodesGE and the first and second channel regions CH1 and CH2. Each of thegate dielectric layers GI may extend along a bottom surface of acorresponding one of the gate electrodes GE. Each of the gate dielectriclayers GI may cover the top surface and the opposite sidewalls of eachof the first and second channel regions CH1 and CH2. The gate dielectriclayers GI may include a high-k dielectric material whose dielectricconstant is greater than that of a silicon oxide layer. For example, thehigh-k dielectric material may include one or more of hafnium oxide,hafnium silicon oxide, lanthanum oxide, zirconium oxide, zirconiumsilicon oxide, tantalum oxide, titanium oxide, barium strontium titaniumoxide, barium titanium oxide, strontium titanium oxide, lithium oxide,aluminum oxide, lead scandium tantalum oxide, and lead zinc niobate.

A gate capping layer CP may be provided on each of the gate electrodesGE. The gate capping layers CP may extend in the first direction D1along the gate electrodes GE. The gate capping layers GP may include amaterial exhibiting an etch selectivity to first and second interlayerdielectric layers 110 and 120 which will be discussed below. Forexample, the gate capping layers CP may include one or more of SiON,SiCN, SiCON, and SiN.

A mixed separation structure CDB may be provided on a cell boundarybetween the first and second logic cells LC1 and LC2 and on a cellboundary between the second and third logic cells LC2 and LC3. The mixedseparation structure CDB may extend in the first direction D1 andseparate neighboring logic cells from each other. The mixed separationstructure CDB may include a first separation structure DB1 and a secondseparation structure DB2. The first separation structure DB1 may beprovided on other cell boundary of the first logic cell LC1 and on othercell boundary of the third logic cell LC3.

The first separation structure DB1 may fill a third trench TR3 extendingin the first direction D1. The third trench TR3 may mutually separate apair of the active patterns FN1 and FN2 adjacent to each other in thesecond direction D2. For example, the third trench TR3 may havesubstantially the same depth as that of the second trench TR2. The thirdtrench TR3 may be deeper than the first trench TR1. For another example,the third trench TR3 may have a different depth from that of the secondtrench TR2. The first separation structure DB1 may be the deviceisolation layer ST filling the third trench TR3. The first separationstructure DB1 may thus include the same silicon oxide layer as that ofthe device isolation layer ST. The first separation structure DB1 mayhave a width in the second direction D2, which width may besubstantially the same as a distance between opposite sidewalls of apair of neighboring gate electrodes GE.

The first separation structure DB1 of the mixed separation structure CDBmay selectively run across the second active region NR except for thefirst active region PR. The first separation structure DB1 of the mixedseparation structure CDB may separate the second active pattern FN2 ofthe first logic cell LC1 from the second active pattern FN2 of thesecond logic cell LC2. The first separation structure DB1 of the mixedseparation structure CDB may separate the second active pattern FN2 ofthe second logic cell LC2 from the second active pattern FN2 of thethird logic cell LC3.

The second separation structure DB2 may extend in the first direction D1and run across the first and second active regions PR and NR. On thefirst active region PR, the second separation structure DB2 may extendin the first direction D1 and run across upper portions of the firstactive pattern FN1. On the second active region NR, the secondseparation structure DB2 may be disposed on the first separationstructure DB1. For example, the first separation structure DB1 may havea bottom surface whose level is lower than that of a bottom surface ofthe second separation structure DB2.

The second separation structure DB2 may include a first segment DB2 aand a second segment DB2 b at opposite sides thereof. The first andsecond segments DB2 a and DB2 b may be parallel in and extend in thefirst direction D1. Each of the first and second segments DB2 a and DB2b may have substantially the same width as that of the gate electrodeGE. The first and second segments DB2 a and DB2 b may have a secondpitch P2 therebetween. The second pitch P2 may be substantially the sameas the first pitch P1 between the gate electrodes GE.

The level of the bottom surface of the second separation structure DB2may fall and then rise back as approaching the second segment DB2 b fromthe first segment DB2 a. The level of the bottom surface of the secondseparation structure DB2 may become a minimum at a site between thefirst and second segments DB2 a and DB2 b. For example, when viewed incross-section along the second direction D2, the second separationstructure DB2 may have a U-shaped profile (see, e.g., FIGS. 7A and 7B).

The bottom surface of the second separation structure DB2 on the firstactive patterns FN1 may have a lowest level LV1 higher than a lowestlevel LV2 of the bottom surface of the second separation structure DB2on the first separation structure DB1.

A pair of the gate spacers GS may be provided on opposite sidewalls ofthe second separation structure DB2. The second separation structure DB2may have a top surface whose level is higher than that of a top surfaceof the gate electrode GE. The top surface of the second separationstructure DB2 may be coplanar with that of a first interlayer dielectriclayer 110 which will be discussed below.

The second separation structure DB2 may include an insulating materialthe same as or different from that of the first separation structureDB1. For example, the second separation structure DB2 may include asilicon oxide layer, a silicon nitride layer, or a silicon oxynitridelayer.

The mixed separation structure CDB may have a width W1′ in the seconddirection D2, which width W1′ may be greater than the first pitch P1between the gate electrodes GE. The width W1′ of the mixed separationstructure CDB may be substantially the same as a width of each of thefirst and second separation structures DB1 and DB2.

The first separation structure DB1 of the mixed separation structure CDBmay increase a breakdown voltage between the second source/drain regionsSD2 disposed on opposite sides of the first separation structure DB1.The second separation structure DB2 of the mixed separation structureCDB may provide stresses to the gate electrodes GE adjacent to thesecond separation structure DB2. A semiconductor device according tosome exemplary embodiments may be configured in such a way that thefirst and second separation structures DB1 and DB2 are combined to formthe mixed separation structure CDB. The mixed separation structure CDBmay affect performance of the semiconductor device. The semiconductordevice may improve in electrical characteristics when the first andsecond separation structures DB1 and DB2 are appropriately arranged inthe mixed separation structure CDB.

The substrate 100 may be provided thereon with a first interlayerdielectric layer 110, a second interlayer dielectric layer 120, and athird interlayer dielectric layer 130 that are sequentially stacked.Each of the first to third interlayer dielectric layers 110, 120, and130 may include a silicon oxide layer or a silicon oxynitride layer.

A pair of the gate electrodes GE may be provided therebetween with oneor more active contacts AC that penetrate the first and secondinterlayer dielectric layers 110 and 120 to come into electricalconnection with the first and second source/drain regions SD1 and SD2.The active contacts AC may have a bar shape extending in the firstdirection D1. For example, one or more active contacts AC may beconnected to a plurality of the first source/drain regions SD1. Forexample, one or more active contacts AC may be connected to a pluralityof the second source/drain regions SD2.

At least one gate electrode GE may be provided thereon with at least onegate contact GC that penetrates the second interlayer dielectric layer120 and the gate capping layer CP to come into electrical connectionwith at least one gate electrode GE. The gate contact GC may have a barshape extending in the second direction D2. When viewed in plan, thegate contact GC may be disposed between the first and second activeregions PR and NR. The gate contact GC may vertically overlap the deviceisolation layer ST filling the second trench TR2 between the first andsecond active regions PR and NR.

The active contacts AC and the gate contacts GC may include the sameconductive material. The active contacts AC and the gate contacts GC mayinclude at least one metallic material selected from, for example,aluminum, copper, tungsten, molybdenum, and cobalt.

The third interlayer dielectric layer 130 may be provided therein withinterconnection lines IL and vias VI. For example, the interconnectionlines IL and the vias VI may constitute a first metal layer. Theinterconnection lines IL may include power lines VDD and VSS that runacross the first to third logic cells LC1, LC2, and LC3 and extend inthe second direction D2.

The vias VI may be interposed between the interconnection lines IL andthe active contacts AC and between the interconnection lines IL and thegate contacts GC, thereby electrically connecting the interconnectionlines IL to the active contacts AC and also electrically connecting theinterconnection lines IL to the gate contacts GC. The interconnectionlines IL and the vias VI may include the same conductive material. Forexample, the interconnection lines IL and the vias VI may include atleast one metallic material selected from aluminum, copper, tungsten,molybdenum, and cobalt.

The interconnection line IL and its underlying via VI may be integrallyconnected to constitute one conductive structure. For example, theinterconnection line IL and the via VI may be formed simultaneously witheach other. In some exemplary embodiments, a dual damascene process maybe performed such that the interconnection line IL and the via VI areformed as one conductive structure.

Although not shown, one or more additional metal layers may be providedon the first metal layer. Through the first metal layer and theadditional metal layers, the first to third logic cells LC1, LC2, andLC3 may be connected to one another in accordance with a designedcircuit.

FIGS. 8, 10, and 12 illustrate plan views showing a method ofmanufacturing a semiconductor device according to exemplary embodiments.FIGS. 9A to 9D illustrate cross-sectional views respectively taken alonglines I-I′, II-II′, III-III′, and IV-IV′ of FIG. 8. FIGS. 11A to 11Eillustrate cross-sectional views respectively taken along lines I-I′,II-II′, III-III′ IV-IV′, and V-V′ of FIG. 10. FIGS. 13A to 13Eillustrate cross-sectional views respectively taken along lines I-I′,II-II′, III-III′, IV-IV′, and V-V′ of FIG. 12. According to someexemplary embodiments, a method of manufacturing a semiconductor deviceincludes that the layout of FIG. 5 is used to actually form patterns ona substrate.

Referring to FIGS. 5, 8, and 9A to 9D, a substrate 100 may be provided.For example, the substrate 100 may be or include a silicon substrate, agermanium substrate, or a silicon-on-insulator (SOI) substrate.

An upper portion of the substrate 100 may be patterned to form firsttrenches TR1 extending in a second direction D2. The first trenches TR1may define first and second active patterns FN1 and FN2 on the upperportion of the substrate 100. The first and second active patterns FN1and FN2 may be arranged along a first direction D1.

The upper portion of the substrate 100 may be patterned to form a secondtrench TR2 that defines a first active region PR and a second activeregion NR. When the second trench TR2 is formed, the active patterns FN1and FN2 may be removed from an area where the second trench TR2 isformed. The formation of the second trench TR2 may include performing anetching process that uses a photomask fabricated based on the first andsecond active region patterns RXP and RXN of FIG. 5.

The upper portion of the substrate 100 may be patterned to form thirdtrenches TR3 on boundaries among first to third logic cells LC1, LC2,and LC3. When the third trenches TR3 are formed, the active patterns FN1and FN2 may be removed from areas where the third trenches TR3 areformed. The formation of the third trenches TR3 may include performingan etching process that uses a photomask fabricated based on the firstdiffusion break patterns FC of FIG. 5.

For example, the second and third trenches TR2 and TR3 may be formed tohave the same depth as each other. For example, the second and thirdtrenches TR2 and TR3 may be simultaneously formed by the same etchingprocess. The second and third trenches TR2 and TR3 may be deeper thanthe first trenches TR1.

A device isolation layer ST may be formed to fill the first to thirdtrenches TR1, TR2, and TR3. Silicon oxide may be used to form the deviceisolation layer ST. For example, the formation of the device isolationlayer ST may include forming on the substrate 100 an insulation layerfilling the first to third trenches TR1, TR2, and TR3, and thenrecessing the insulation layer until the first and second activepatterns FN1 and FN2 are exposed on their upper portions. The deviceisolation layer ST filling the third trenches TR3 may be defined asfirst separation structures DB1.

Referring to FIGS. 5, 10, and 11A to 11E, gate electrodes GE may beformed to extend in the first direction D1 and to run across the firstand second active patterns FN1 and FN2. Gate dielectric layers GI may beformed below the gate electrodes GE. Gate spacers GS may be formed onopposite sides of each of the gate electrodes GE. Gate capping layers CPmay be formed on the gate electrodes GE. For example, a pair of the gateelectrodes GE may be formed on the first separation structure DB1 (seeFIG. 11B).

In some exemplary embodiments, the formation of the gate electrodes GEmay include forming sacrificial patterns to run across the first andsecond active patterns FN1 and FN2, forming the gate spacers GS onopposite sides of each of the sacrificial patterns, and replacing thesacrificial patterns with the gate electrodes GE.

The gate electrodes GE may include one or more of metal and conductivemetal nitride. The gate dielectric layers GI may include a high-kdielectric material whose dielectric constant is greater than that of asilicon oxide layer. The gate spacers GS may include one or more ofSiCN, SiCON, and SiN. The gate capping layers CP may include one or moreof SiON, SiCN, SiCON, and SiN.

First source/drain regions SD1 may be formed on upper portions of thefirst active patterns FN1. Second source/drain regions SD2 may be formedon upper portions of the second active patterns FN2. The first andsecond source/drain regions SD1 and SD2 may be formed on opposite sidesof each of the gate electrodes GE. The first source/drain regions SD1may be doped with p-type impurities, and the second source/drain regionsSD2 may be doped with n-type impurities.

The first and second source/drain regions SD1 and SD2 may be epitaxialpatterns formed by a selective epitaxial growth process. For example, apartial recess process may be performed on the first and second activepatterns FN1 and FN2 formed on opposite sides of each of the gateelectrodes GE, and then an epitaxial growth process may be performed onthe recessed portions of the first and second active patterns FN1 andFN2.

A first interlayer dielectric layer 110 may be formed on an entiresurface of the substrate 100. The first interlayer dielectric layer 110may be formed of a silicon oxide layer or a silicon oxynitride layer.The first interlayer dielectric layer 110 may have a top surfacesubstantially coplanar with those of the gate spacers GS and those ofthe gate capping layers CP.

Referring to FIGS. 5, 12, and 13A to 13E, second separation structuresDB2 may be formed on a cell boundary between the first and second logiccells LC1 and LC2 and on a cell boundary between the second and thirdlogic cells LC2 and LC3.

The second separation structure DB2 between the first and second logiccells LC1 and LC2 may be formed on the first separation structure DB1between the first and second logic cells LC1 and LC2. A mixed separationstructure CDB may be constituted by the first and second separationstructures DB1 and DB2 that are formed between the first and secondlogic cells LC1 and LC2. The second separation structure DB2 between thesecond and third logic cells LC2 and LC3 may be formed on the firstseparation structure DB1 between the second and third logic cells LC2and LC3. A mixed separation structure CDB may be constituted by thefirst and second separation structures DB1 and DB2 that are formedbetween the second and third logic cells LC2 and LC3.

For example, a mask layer HM may be formed on the first interlayerdielectric layer 110. The mask layer HM may include an opening OP thatexposes the cell boundary between the first and second logic cells LC1and LC2 and also include an opening OP that exposes the cell boundarybetween the second and third logic cells LC2 and LC3. The openings OP ofthe mask layer HM may be formed by performing an etching process thatuses a photomask fabricated based on the second diffusion break patternsRC of FIG. 5.

An anisotropic etching process may be performed to etch the gate cappinglayers CP, the gate spacers GS, the gate electrodes GE, the gatedielectric layers GI, the first active patterns FN1, and the deviceisolation layer ST that are exposed to the openings OP of the mask layerHM that serves as an etching mask of the anisotropic etching process.The first active patterns FN1 may be removed on their upper portionsexposed to the openings OP, which removal may cause the first activepatterns FN1 of neighboring logic cells are separated from each other.

After the anisotropic etching process, the openings OP may be filledwith an insulating material to form second separation structures DB2.The insulating material may include a silicon oxide layer, a siliconnitride layer, or a silicon oxynitride layer.

During the anisotropic etching process, an area where the firstinterlayer dielectric layer 110 is positioned may be etched more thanareas where the gate capping layers CP, the gate electrodes GE, and thegate spacers SG are positioned. As a result, each of the secondseparation structures DB2 may be formed to have a U-shaped cross-sectionin the second direction D2.

Referring back to FIGS. 5, 6, and 7A to 7E, a planarization process maybe performed until a top surface of the first interlayer dielectriclayer 110 is exposed. A second interlayer dielectric layer 120 may beformed on the first interlayer dielectric layer 110.

Active contacts AC and gate contacts GC may be formed to penetrate thefirst and second interlayer dielectric layers 110 and 120. The activecontacts AC may be formed on the first and second source/drain regionsSD1 and SD2. The active contacts AC may have a linear shape extending inthe first direction D1. The gate contacts GC may be formed on the gateelectrodes GE. The gate contacts GC may have a bar shape extending inthe second direction D2.

A third interlayer dielectric layer 130 may be formed on the secondinterlayer dielectric layer 120. Interconnection lines IL and vias VImay be formed in the third interlayer dielectric layer 130. The vias VImay be formed between the interconnection lines IL and the activecontacts AC and between the interconnection lines IL and the gatecontacts GC.

FIG. 14 illustrates a layout according to exemplary embodiments. In theexemplary embodiment that follows, a detailed description of technicalfeatures repetitive to those discussed above with reference to FIGS. 4and 5 will be omitted, and a difference thereof will be discussed indetail.

Referring to FIGS. 3 and 14, the mixed diffusion break pattern CSC maybe provided on each of the first and second cell boundaries BD1 and BD2(S120). The mixed diffusion break pattern CSC may include the firstdiffusion break pattern FC and a pair of the second diffusion breakpatterns RC.

The pair of the second diffusion break patterns RC may parallel extendin the first direction D1. The pair of the second diffusion breakpatterns RC may be disposed to overlap a pair of the gate patterns GP.Likewise the first diffusion break pattern FC, the pair of the seconddiffusion break patterns RC may separate neighboring standard cells fromeach other.

FIG. 15 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments. FIGS. 16A to 16C illustrate cross-sectionalviews respectively taken along lines I-I′, II-II′, and III-III′ of FIG.15. FIGS. 15 and 16A to 16C exemplarily show a semiconductor deviceactually achieved on a substrate when the layout of FIG. 14 is used. Inthe exemplary embodiment that follows, a detailed description oftechnical features repetitive to those discussed above with reference toFIGS. 6 and 7A to 7E will be omitted, and a difference thereof will bediscussed in detail.

Referring to FIGS. 14, 15, and 16A to 16C, the mixed separationstructure CDB may be provided on each of the cell boundary between thefirst and second logic cells LC1 and LC2 and the cell boundary betweenthe second and third logic cells LC2 and LC3. The mixed separationstructure CDB may include the first separation structure DB1 and a pairof the second separation structures DB2.

The pair of the second separation structures DB2 may extend in the firstdirection D1 and run across the first and second active regions PR andNR. A pair of the gate spacers GS may be provided on opposite sidewallsof each of the pair of the second separation structures DB2. On thefirst active region PR, the first source/drain region SD1 may beinterposed between the pair of the second separation structures DB2.

Each of the pair of the second separation structures DB2 may havesubstantially the same width as that of the gate electrode GE. The pairof the second separation structures DB2 may have a third pitch P3therebetween. The second separation structure DB2 and its adjacent gateelectrode GE may have a fourth pitch P4 therebetween. The third pitch P3may be substantially the same as the first pitch P1 between the gateelectrodes GE. The fourth pitch P4 may be substantially the same as thefirst pitch P1 between the gate electrodes GE.

FIGS. 17A and 17B illustrate cross-sectional views respectively takenalong lines I-I′ and II-II′ of FIG. 15, showing a method ofmanufacturing a semiconductor device according to exemplary embodiments.According to some exemplary embodiments, a method of manufacturing asemiconductor device includes that the layout of FIG. 14 is used toactually form patterns on a substrate.

Referring to FIGS. 14, 15, and 17A and 17B, the mask layer HM may beformed on a resultant structure shown in FIGS. 10 and 11A to 11E. Themask layer HM may include a pair of the openings OP that expose the cellboundary between the first and second logic cells LC1 and LC2. The masklayer HM may include a pair of the openings OP that expose the cellboundary between the second and third logic cells LC2 and LC3. The pairof the openings OP of the mask layer HM may be formed by performing anetching process that uses a photomask fabricated based on the seconddiffusion break patterns RC of FIG. 14.

The first active patterns FN1 may be removed on their upper portionsexposed to the openings OP when an anisotropic etching process isperformed using the mask layer HM as an etching mask. After theanisotropic etching process, the openings OP may be filled with aninsulating material to form the second separation structures DB2.

FIG. 18 illustrates a layout according to exemplary embodiments. In theexemplary embodiment that follows, a detailed description of technicalfeatures repetitive to those discussed above with reference to FIGS. 4and 5 will be omitted, and a difference thereof will be discussed indetail.

Referring to FIGS. 3 and 18, the mixed diffusion break pattern CSC maybe provided on each of the first and second cell boundaries BD1 and BD2(S120). The mixed diffusion break pattern CSC may include the firstdiffusion break pattern FC (see solid line in FIG. 18) and the seconddiffusion break pattern RC (see light shaded portion in FIG. 18). Thefirst and second diffusion break patterns FC and RC may havesubstantially the same width in the second direction D2.

The first diffusion break pattern FC of the mixed diffusion breakpattern CSC may extend in the first direction D1. The first diffusionbreak pattern FC of the mixed diffusion break pattern CSC may extendfrom the second active region pattern RXN toward the first active regionpattern RXP. The first diffusion break pattern FC of the mixed diffusionbreak pattern CSC may have substantially the same size and shape asthose of the first diffusion break pattern FC of FIG. 4.

The second diffusion break pattern RC may be disposed limitedly on thefirst active region pattern RXP. The second diffusion break pattern RCmay have a size approximately half that of the first diffusion breakpattern FC. That is, the second diffusion break pattern RC may extend upto a boundary of a gate cut pattern CT, described below.

A gate cut pattern CT may be disposed on a pair of the gate patterns GPoverlapping the mixed diffusion break pattern CSC. The gate cut patternCT may be disposed between the first and second active region patternsRXP and RXN. The gate cut pattern CT may define a gate separationstructure.

FIG. 19 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments. FIGS. 20A to 20C illustrate cross-sectionalviews respectively taken along lines I-I′, II-II′, and III-III′ of FIG.19. FIGS. 19 and 20A to 20C exemplarily show a semiconductor deviceactually achieved on a substrate when the layout of FIG. 18 is used. Inthe exemplary embodiment that follows, a detailed description oftechnical features repetitive to those discussed above with reference toFIGS. 6 and 7A to 7E will be omitted, and a difference thereof will bediscussed in detail.

Referring to FIGS. 18, 19, and 20A to 20C, the mixed separationstructure CDB may be provided on each of the cell boundary between thefirst and second logic cells LC1 and LC2 and the cell boundary betweenthe second and third logic cells LC2 and LC3. The mixed separationstructure CDB may include the first separation structure DB1 and thesecond separation structure DB2.

The first separation structure DB1 may extend in the first direction D1and run across the first and second active regions PR and NR. The firstseparation structure DB1 may mutually separate a pair of the activepatterns FN1 and FN2 adjacent to each other in the second direction D2.

The second separation structure DB2 may selectively run across the firstactive region PR except for the second active region NR. On the firstactive region PR, the second separation structure DB2 may be disposed onthe first separation structure DB1.

On the second active region NR, a pair of the gate electrodes GE may bedisposed on the first separation structure DB1 of the mixed separationstructure CDB. A pair of gate separation structures GSP may beinterposed between the second separation structure DB2 and a pair of thegate electrodes GE (see FIG. 20C). The pair of gate separationstructures GSP may be disposed on the first separation structure DB1between the first and second active regions PR and NR. The pair of gateseparation structures GSP may include a silicon oxide layer, a siliconnitride layer, or a silicon oxynitride layer.

A pair of the gate electrodes GE on the first separation structure DB1of the mixed separation structure CDB may be dummy gate electrodes. Thepair of the gate electrodes GE may serve as conductive lines.

FIG. 21 illustrates a layout according to exemplary embodiments. In theexemplary embodiment that follows, a detailed description of technicalfeatures repetitive to those discussed above with reference to FIG. 18will be omitted, and a difference thereof will be discussed in detail.

Referring to FIGS. 3 and 21, the mixed diffusion break pattern CSC maybe provided on each of the first and second cell boundaries BD1 and BD2(S120). The mixed diffusion break pattern CSC may include the firstdiffusion break pattern FC and a pair of the second diffusion breakpatterns RC. The pair of the second diffusion break patterns RC may eachextend up to a boundary of the gate cut pattern CT.

The pair of the second diffusion break patterns RC may parallel extendin the first direction D1. The pair of the second diffusion breakpatterns RC may be disposed to overlap a pair of the gate patterns GP.

FIG. 22 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments. FIG. 23 illustrates a cross-sectional viewtaken along line I-I′ of FIG. 22. FIGS. 22 and 23 exemplarily show asemiconductor device actually achieved on a substrate when the layout ofFIG. 21 is used. In the exemplary embodiment that follows, a detaileddescription of technical features repetitive to those discussed abovewith reference to FIGS. 19 and 20A to 20C will be omitted, and adifference thereof will be discussed in detail.

Referring to FIGS. 21, 22, and 23, the mixed separation structure CDBmay be provided on each of the cell boundary between the first andsecond logic cells LC1 and LC2 and the cell boundary between the secondand third logic cells LC2 and LC3. The mixed separation structure CDBmay include the first separation structure DB1 and a pair of the secondseparation structures DB2.

The pair of the second separation structures DB2 may extend in the firstdirection D1 and selectively run across the first active region PR. Apair of the gate spacers GS may be provided on opposite sidewalls ofeach of the pair of the second separation structures DB2.

A pair of the gate separation structures GSP may be interposed between apair of the gate electrodes GE on the first separation structure DB1 ofthe mixed separation structure CDB and a pair of the second separationstructures DB2 of the mixed separation structure CDB. For example, onthe first separation structure DB1 of the mixed separation structureCDB, the gate electrode GE, the gate separation structure GSP, and thesecond separation structure DB2 may be sequentially arranged along thefirst direction D1. The gate electrode GE, the gate separation structureGSP, and the second separation structure DB2 may be aligned along thefirst direction D1.

FIG. 24 illustrates a layout according to exemplary embodiments. In theexemplary embodiment that follows, a detailed description of technicalfeatures repetitive to those discussed above with reference to FIGS. 4and 5 will be omitted, and a difference thereof will be discussed indetail.

Referring to FIG. 24, the mixed diffusion break pattern CSC may beprovided on each of the first cell boundary BD1 between the first andsecond standard cells STD1 and STD2 and the second cell boundary BD2between the second and third standard cells STD2 and STD3. The mixeddiffusion break pattern CSC may include the first diffusion breakpattern FC and the second diffusion break pattern RC. The seconddiffusion break pattern RC may be provided on each of other cellboundary of the first standard cell STD1 and other cell boundary of thethird standard cell STD3.

The second diffusion break pattern RC may include a wide diffusion breakpattern RCw and a narrow diffusion break pattern RCn. The wide diffusionbreak pattern RCw may correspond to the second diffusion break patternRC of the mixed diffusion break pattern CSC, and the narrow diffusionbreak pattern RCn may correspond to the second diffusion break patternRC provided on the other cell boundary of each of the first and thirdstandard cells STD1 and STD3. A detailed description of the widediffusion break pattern RCw may be substantially the same as that of thesecond diffusion break pattern RC discussed above with reference to FIG.5.

The narrow diffusion break pattern RCn may extend in the first directionD1. The narrow diffusion break pattern RCn may separate neighboringstandard cells from each other. The narrow diffusion break pattern RCnmay define a narrow separation structure. The narrow diffusion breakpattern RCn may overlap the gate pattern GP adjacent to a cell boundary.The narrow diffusion break pattern RCn may have substantially the samewidth as that of the gate pattern GP.

FIG. 25 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments. FIG. 26 illustrates a cross-sectional viewtaken along line I-I′ of FIG. 25. FIGS. 25 and 26 exemplarily show asemiconductor device actually achieved on a substrate when the layout ofFIG. 24 is used. In the exemplary embodiment that follows, a detaileddescription of technical features repetitive to those discussed abovewith reference to FIGS. 6 and 7A to 7E will be omitted, and a differencethereof will be discussed in detail.

Referring to FIGS. 24, 25, and 26, the mixed separation structure CDBmay be provided on each of the cell boundary between the first andsecond logic cells LC1 and LC2 and the cell boundary between the secondand third logic cells LC2 and LC3. The mixed separation structure CDBmay include the first separation structure DB1 and the second separationstructure DB2. A detailed description of the mixed separation structureCDB may be substantially the same as that of the mixed separationstructure CDB discussed above with reference to FIGS. 6 and 7A to 7E.

The second separation structure DB2 may be provided on each of othercell boundary of the first logic cell LC1 and other cell boundary of thethird logic cell LC3. The second separation structure DB2 may include awide separation structure DB2 w and a narrow separation structure DB2 n.The wide separation structure DB2 w may correspond to the secondseparation structure DB2 of the mixed separation structure CDB, and thenarrow separation structure DB2 n may correspond to the secondseparation structure DB2 provided on the other cell boundary of each ofthe first and third logic cells LC1 and LC3.

The narrow separation structure DB2 n may extend in the first directionD1 and run across the first and second active regions PR and NR. A pairof the gate spacers GS may be provided on opposite sidewalls of thenarrow separation structure DB2 n. The narrow separation structure DB2 nmay have substantially the same width as that of the gate electrode GE.The narrow separation structure DB2 n and its adjacent gate electrode GEmay have a fifth pitch P5 therebetween. The fifth pitch P5 may besubstantially the same as the first pitch P1 between the gate electrodesGE.

FIG. 27 illustrates a layout according to exemplary embodiments. In theexemplary embodiment that follows, a detailed description of technicalfeatures repetitive to those discussed above with reference to FIGS. 4and 5 will be omitted, and a difference thereof will be discussed indetail.

Referring to FIG. 27, the first diffusion break pattern FC of the mixeddiffusion break pattern CSC may be disposed limitedly on the firstactive region pattern RXP. For example, the first diffusion breakpattern FC of the mixed diffusion break pattern CSC may separate thefirst active region pattern RXP of the first standard cell STD1 from thefirst active region pattern RXP of the second standard cell STD2.

FIG. 28 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments. FIGS. 29A to 29C illustrate cross-sectionalviews respectively taken along lines I-I′, II-II′, and III-III′ of FIG.28. FIGS. 28 and 29A to 29C exemplarily show a semiconductor deviceactually achieved on a substrate when the layout of FIG. 27 is used. Inthe exemplary embodiment that follows, a detailed description oftechnical features repetitive to those discussed above with reference toFIGS. 6 and 7A to 7E will be omitted, and a difference thereof will bediscussed in detail.

Referring to FIGS. 27, 28, and 29A to 29C, the first separationstructure DB1 of the mixed separation structure CDB may selectively runacross the first active region PR except for the second active regionNR. The first separation structure DB1 of the mixed separation structureCDB may separate the first active pattern FN1 of the first logic cellLC1 from the first active pattern FN1 of the second logic cell LC2. Thefirst separation structure DB1 of the mixed separation structure CDB mayseparate the first active pattern FN1 of the second logic cell LC2 fromthe first active pattern FN1 of the third logic cell LC3.

FIG. 30 illustrates a layout according to exemplary embodiments. In theexemplary embodiment that follows, a detailed description of technicalfeatures repetitive to those discussed above with reference to FIGS. 4and 5 will be omitted, and a difference thereof will be discussed indetail.

Referring to FIG. 30, the first and second diffusion break patterns FCand RC of the mixed diffusion break pattern CSC may substantiallyoverlap each other. For example, the first and second diffusion breakpatterns FC and RC of the mixed diffusion break pattern CSC may havesubstantially the same size and shape. The first diffusion break patternFC of the mixed diffusion break pattern CSC may extend from the secondactive region pattern RXN toward the first active region pattern RXP.The second diffusion break pattern RC of the mixed diffusion breakpattern CSC may extend from the second active region pattern RXN towardthe first active region pattern RXP.

FIG. 31 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments. FIGS. 32A and 32B illustrate cross-sectionalview respectively taken along lines I-I′ and II-II′ of FIG. 25. FIGS.31, 32A, and 32B exemplarily show a semiconductor device actuallyachieved on a substrate when the layout of FIG. 30 is used. In theexemplary embodiment that follows, a detailed description of technicalfeatures repetitive to those discussed above with reference to FIGS. 6and 7A to 7E will be omitted, and a difference thereof will be discussedin detail.

Referring to FIGS. 30, 31, 32A, and 32B, the mixed separation structureCDB may be provided on each of the cell boundary between the first andsecond logic cells LC1 and LC2 and the cell boundary between the secondand third logic cells LC2 and LC3.

The mixed separation structure CDB may be configured in such a way thatthe second separation structure DB2 is provided on the first separationstructure DB1. The mixed separation structure CDB may have a structurein which the second separation structure DB2 vertically overlaps thefirst separation structure DB1. The first active patterns FN1 inneighboring logic cells may be separated from each other by the mixedseparation structure CDB having a structure where the first and secondseparation structures DB1 and DB2 are stacked. The second activepatterns FN2 in neighboring logic cells may be separated from each otherby the mixed separation structure CDB having a structure where the firstand second separation structures DB1 and DB2 are stacked.

FIG. 33 illustrates a layout according to exemplary embodiments. In theexemplary embodiment that follows, a detailed description of technicalfeatures repetitive to those discussed above with reference to FIGS. 4and 5 will be omitted, and a difference thereof will be discussed indetail.

Referring to FIG. 33, the first active region pattern RXP may have avariable width in the first direction D1. For example, the first activeregion pattern RXP of the first standard cell STD1 may have a secondwidth W2 in the first direction D1. The first active region pattern RXPof the second standard cell STD2 may have a third width W3 in the firstdirection D1. The first active region pattern RXP of the third standardcell STD3 may have a fourth width W4 in the first direction D1. Thesecond to fourth widths W2, W3, and W4 may be different from oneanother. The third width W3 may be greater than the second width W2, andthe fourth width W4 may be greater than the third width W3.

The second active region pattern RXN may have a variable width in thefirst direction D1. For example, the second active region pattern RXN ofthe first standard cell STD1 may have a fifth width W5 in the firstdirection D1. The second active region pattern RXN of the secondstandard cell STD2 may have a sixth width W6 in the first direction D1.The second active region pattern RXN of the third standard cell STD3 mayhave a seventh width W7 in the first direction D1. The fifth to seventhwidths W5, W6, and W7 may be different from one another. The sixth widthW6 may be greater than the fifth width W5, and the fifth and seventhwidths W5 and W7 may be substantially the same as each other.

Within the mixed diffusion break pattern CSC on the first cell boundaryBD1, the first and second active region patterns RXP and RXN may havetheir variable widths. For example, within the mixed diffusion breakpattern CSC on the first cell boundary BD1, the width of the firstactive region pattern RXP may be changed from the second width W2 intothe third width W3. Within the mixed diffusion break pattern CSC on thefirst cell boundary BD1, the width of the second active region patternRXN may be changed from the fifth width W5 into the sixth width W6.

Within the mixed diffusion break pattern CSC on the second cell boundaryBD2, the first and second active region patterns RXP and RXN may havetheir variable widths. For example, within the mixed diffusion breakpattern CSC on the second cell boundary BD2, the width of the firstactive region pattern RXP may be changed from the third width W3 intothe fourth width W4. Within the mixed diffusion break pattern CSC on thesecond cell boundary BD2, the width of the second active region patternRXN may be changed from the sixth width W6 into the seventh width W7.

FIG. 34 illustrates a plan view showing a semiconductor device accordingto exemplary embodiments. FIGS. 35A and 35B illustrate cross-sectionalviews respectively taken along lines I-I′ and II-II′ of FIG. 34. FIGS.34, 35A, and 35B exemplarily show a semiconductor device actuallyachieved on a substrate when the layout of FIG. 33 is used. In theexemplary embodiment that follows, a detailed description of technicalfeatures repetitive to those discussed above with reference to FIGS. 6and 7A to 7E will be omitted, and a difference thereof will be discussedin detail.

Referring to FIGS. 33, 34, 35A, and 35B, the first active region PR mayhave a variable width in the first direction D1. The variation in widthof the first active region PR may be similar to that of the first activeregion pattern RXP discussed above with reference to FIG. 33. The secondactive region NR may have a variable width in the first direction D1.The variation in width of the second active region NR may be similar tothat of the second active region pattern RXN discussed above withreference to FIG. 33.

The first logic cell LC1 may include one first active pattern FN1, thesecond logic cell LC2 may include two first active patterns FN1, and thethird logic cell LC3 may include three first active patterns FN1. Thefirst logic cell LC1 may include two second active patterns FN2, thesecond logic cell LC2 may include three second active patterns FN2, andthe third logic cell LC3 may include two second active patterns FN2.

The number of the first active patterns FN1 on one side of the mixedseparation structure CDB may be different from that of the first activepatterns FN1 on opposite side of the mixed separation structure CDB. Thenumber of the second active patterns FN2 on one side of the mixedseparation structure CDB may be different from that of the second activepatterns FN2 on opposite side of the mixed separation structure CDB. Forexample, the second logic cell LC2 may include two first active patternsFN1 and three second active patterns FN2 (see FIG. 35A). The third logiccell LC3 may include three first active patterns FN1 and two secondactive patterns FN2 (see FIG. 35B). The mixed separation structure CDBmay be positioned between the second and third logic cells LC2 and LC3and the number of active patterns on one side of the mixed separationstructure CDB may be different from that of active patterns on oppositeside of the mixed separation structure CDB. The mixed separationstructure CDB may be positioned on an area where the number of activepatterns is changed, which configuration may prevent occurrence ofvarious variables caused by the change in number of active patterns.

According to exemplary embodiments, semiconductor devices may beconfigured in such a way that a mixed separation structure is providedon a boundary between neighboring logic cells. Electricalcharacteristics of semiconductor devices may be improved by appropriatearrangement of first and second separation structures in the mixedseparation structure.

Although exemplary embodiments have been discussed with reference toaccompanying figures, it will be understood that various changes in formand details may be made therein without departing from the spirit andscope of exemplary embodiments. It therefore will be understood that theexemplary embodiments described above are just illustrative but notlimitative in all aspects, the scope being defined by the appendedclaims.

What is claimed is:
 1. A semiconductor device comprising: a first logiccell and a second logic cell that are adjacent to each other on asubstrate; and a mixed separation structure extending in a firstdirection between the first logic cell and the second logic cell,wherein each of the first logic cell and the second logic cellcomprises: a first active fin and a second active fin that protrude fromthe substrate, the first and second active fins extending in a seconddirection intersecting the first direction and being spaced apart fromeach other in the first direction; and a plurality of gate electrodesextending in the first direction and spanning the first active fin andthe second active fin, and having a gate pitch, and wherein the mixedseparation structure comprises: a first separation structure separatingthe first active fin of the first logic cell from the first active finof the second logic cell; and a second separation structure on the firstseparation structure, wherein a width of the first separation structureis greater than the gate pitch.
 2. The semiconductor device of claim 1,wherein the second separation structure extends in the first directionand separates the second active fin of the first logic cell from thesecond active fin of the second logic cell.
 3. The semiconductor deviceof claim 2, wherein the first active fin comprises a plurality of firstsource/drain regions on a first upper portion of the first active fin,the second active fin comprises a plurality of second source/drainregions on a second upper portion of the second active fin, the secondseparation structure is provided between a first source/drain region ofthe first logic cell and a first source/drain region of the second logiccell, and the second separation structure is provided between a secondsource/drain region of the first logic cell and a second source/drainregion of the second logic cell.
 4. The semiconductor device of claim 2,wherein a first lowest level of a first bottom surface of the secondseparation structure on the second active fin is higher than a secondlowest level of a second bottom surface of the second separationstructure on the first separation structure.
 5. The semiconductor deviceof claim 1, wherein the second active fin is spaced apart in the firstdirection from the first separation structure.
 6. The semiconductordevice of claim 1, wherein the second separation structure comprises afirst segment and a second segment at opposite sides of the secondseparation structure, wherein the first segment and the second segmentare spaced apart from each other in the second direction, and wherein asegment pitch between the first segment and the second segment issubstantially the same as the gate pitch.
 7. The semiconductor device ofclaim 1, further comprising a first gate spacer and a second gatespacer, the first gate spacer provides on a first sidewall of the secondseparation structure and the second gate spacer provides on a secondsidewall of the second separation structure opposite from the firstsidewall.
 8. The semiconductor device of claim 1, wherein the secondseparation structure comprises a pair of second separation structures onthe first separation structure, wherein a separation pitch between thepair of second separation structures is substantially the same as thegate pitch.
 9. A semiconductor device comprising: a substrate includinga first active region and a second active region, the first activeregion and the second active region being spaced apart from each otherin a first direction and extending in a second direction intersectingthe first direction; a device isolation layer provided on the substrateand defining a first active pattern and a second active pattern, thefirst and second active patterns protruding beyond the device isolationlayer and extending in the second direction on the first and secondactive regions, respectively; and a mixed separation structure spanningthe first active region and the second active region and extending inthe first direction, wherein the mixed separation structure comprises: afirst separation structure selectively spanning the first active patternexcept for the second active pattern; and a second separation structurespanning the first active pattern and the second active pattern, whereina first level of a first bottom surface of the first separationstructure is lower than a second level of a second bottom surface of thesecond separation structure.
 10. The semiconductor device of claim 9,further comprising a plurality of gate electrodes extending in the firstdirection and spanning the first active pattern and the second activepattern, and having a gate pitch, wherein a width of the firstseparation structure is greater than the gate pitch.
 11. Thesemiconductor device of claim 9, wherein the first active patterncomprises a plurality of first source/drain regions having a firstconductivity on a first upper portion of the first active pattern, andthe second active pattern comprises a plurality of second source/drainregions having a second conductivity on a second upper portion of thesecond active pattern, the second conductivity being different from thefirst conductivity.
 12. The semiconductor device of claim 9, wherein afirst lowest level of a first bottom surface of the second separationstructure on the second active pattern is higher than a second lowestlevel of a second bottom surface of the second separation structure onthe first separation structure.
 13. The semiconductor device of claim 9,wherein the second separation structure comprises a second insulatingmaterial different from a first insulating material of the firstseparation structure.
 14. A semiconductor device comprising: a firstlogic cell and a second logic cell that are adjacent to each other on asubstrate; and a mixed separation structure extending in a firstdirection between the first logic cell and the second logic cell,wherein each of the first logic cell and the second logic cellcomprises: a first active region provided with a plurality of firstFinFETs having a first conductivity; and a second active region providedwith a plurality of second FinFETs having a second conductivitydifferent from the first conductivity, and wherein the mixed separationstructure comprises: a first separation structure separating the firstactive region of the first logic cell from the first active region ofthe second logic cell; and a second separation structure extending inthe first direction on the first separation structure and separating thesecond active region of the first logic cell from the second activeregion of the second logic cell, wherein the second separation structurecomprises a second insulating material different from a first insulatingmaterial of the first separation structure.
 15. The semiconductor deviceof claim 14, wherein a first level of a first bottom surface of thefirst separation structure is lower than a second level of a secondbottom surface of the second separation structure.
 16. The semiconductordevice of claim 14, wherein the second active region is spaced apart inthe first direction from the first active region, and the first activeregion and the second active region extend in a second directionintersecting the first direction.
 17. The semiconductor device of claim14, wherein the first separation structure selectively separates thefirst active region except for the second active region.
 18. Thesemiconductor device of claim 14, wherein a width of the firstseparation structure is greater than a pitch between a plurality of gateelectrodes of the plurality of first FinFETs and the plurality of secondFinFETs.